Title :
Local CDM ESD Protection Circuits for Cross-Power Domains in 3D IC Applications
Author :
Shih-Hung Chen ; Linten, D. ; Scholz, Matthias ; Yu-Ching Huang ; Hellings, Geert ; Boschke, Roman ; Ming-Dou Ker ; Groeseneken, Guido
Author_Institution :
IMEC, Leuven, Belgium
Abstract :
CDM ESD events can be a potential threat to SoC designs or heterogeneous 3D ICs with multiple power domains. Inter-layer (or interface) circuits may need a local CDM ESD clamp that can prevent the unexpected failure under CDM ESD stress. In this letter, two local CDM ESD clamp circuits are proposed. They show better clamping efficiency under 2-ns vfTLP stress.
Keywords :
electrostatic discharge; integrated circuit modelling; system-on-chip; three-dimensional integrated circuits; SoC designs; charged device model; clamping efficiency; cross-power domains; heterogeneous 3D integrated circuits; interlayer circuits; local CDM ESD clamp circuits; local CDM ESD protection circuits; very fast transmission line pulsing; vfTLP; Clamps; Electrostatic discharges; Integrated circuits; Logic gates; MOS devices; Stress; Three-dimensional displays; 3D stacked ICs; Electrostatic discharge (ESD); charged device model (CDM); cross-power domains ESD events; vary-fast transmission line pulsing (vfTLP) systems;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2014.2320538
