Title :
An Equation-Based Circuit Model and Its Generation Tool for 3-D IC Power Delivery Networks With an Emphasis on Coupling Effect
Author :
Chi-Hsuan Cheng ; Tai-Yu Cheng ; Cheng-Han Du ; Yi-Chang Lu ; Yih-Peng Chiou ; Liu, Siyuan ; Tzong-Lin Wu
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
In this paper, a methodology to characterize the electrical behaviors of power delivery networks (PDNs) in 3-D integrated circuits is presented. An automation tool is developed to effectively construct SPICE compatible equivalent circuit models of target PDNs. The core of the tool consists of three equation-based algorithms, which not only model the planar PDN and through-silicon vias in detail, but also the interactions between them through the silicon surface. Simulation results from the proposed SPICE model are in close agreement with the ones obtained from the full-wave simulator up to 40 GHz with more than 100 times speedup.
Keywords :
equivalent circuits; integrated circuit modelling; power integrated circuits; three-dimensional integrated circuits; 3D IC power delivery networks; 3D integrated circuits; SPICE compatible equivalent circuit models; Si; automation tool; coupling effect; equation-based circuit model; silicon surface; through-silicon vias; Capacitance; Couplings; Integrated circuit modeling; Mathematical model; Silicon; Substrates; Wires; 3-D integrated circuits (3-D ICs); design automation and methodology; equation-based modeling; power delivery network (PDN); power delivery network (PDN).;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2014.2316301
