Title :
Low-Cost Analog/RF IC Testing Through Combined Intra- and Inter-Die Correlation Models
Author :
Ke Huang ; Kupp, Nathan ; Xanthopoulos, Constantinos ; Carulli, John M. ; Makris, Yiorgos
Abstract :
This paper presents statistical methods to identify and take advantage of correlations in the test methods and wafer-level spatial correlations among devices. The result, shown for industrial designs, is a far more optimized test suite.
Keywords :
analogue integrated circuits; integrated circuit testing; radiofrequency integrated circuits; analog-RFIC testing; industrial designs; inter-die correlation; intra-die correlation; statistical methods; wafer-level spatial correlations; Analog circuits; Computational modeling; Costs; Integrated circuit modeling; Mixed analog digital integrated circuits; Performance evaluation; Radio frequency; Semiconductor device modeling; Statistical analysis; System-on-chip; Adaptive test; alternate test; analog and RF test; joint correlation model; spatial correlation modeling;
Journal_Title :
Design & Test, IEEE
DOI :
10.1109/MDAT.2014.2361721
