Title :
A Low-Voltage CMOS-Microelectromechanical Systems Thermal-Piezoresistive Resonator With
Author :
Cheng-Syun Li ; Ming-Huang Li ; Cheng-Chi Chen ; Chi-Hang Chin ; Sheng-Shian Li
Author_Institution :
Inst. of NanoEngineering & Microsyst., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
We report a thermally driven and piezoresistively sensed CMOS-microelectromechanical systems (MEMS) resonator with quality factor Q >10000 and stopband rejection of 15 dB under CMOS-compatible bias voltage. The bias voltage requirement of this letter is two orders of magnitude lower than that of the previous CMOS-MEMS capacitively transduced resonators. In addition, the combination of the bulkmode resonator design and highQ SiO2/polysilicon structural material leads to resonator Q >10000, a key index for low-phasenoise oscillators and low-insertion-loss filters. The resonator with a center frequency at 5.1 MHz was fabricated using a standard 0.35 μm 2-poly-4-metal CMOS process, featuring low cost, batch production, fast turnaround time, easy prototyping, and MEMS/IC integration. To resolve the feedthrough issue often seen in conventional thermal-piezoresistive resonators: 1) separation of the heater and piezoresistor is first adopted because of the routing flexibility of the structural configuration offered by CMOS back-end-of-line materials and 2) fully differential measurement scheme is then applied to the proposed device, both of which enable a low-feedthrough level with 65-dB improvement as compared with its single-ended counterpart.
Keywords :
CMOS integrated circuits; elemental semiconductors; integrated circuit design; integrated circuit noise; low-power electronics; microfabrication; micromechanical resonators; microsensors; piezoresistive devices; radiofrequency filters; radiofrequency integrated circuits; radiofrequency oscillators; resistors; resonator filters; silicon; silicon compounds; thermal engineering; CMOS back-end-of-line material; CMOS-MEMS capacitively transduced resonator; CMOS-compatible bias voltage; MEMS; MEMS-IC integration; SiO2-Si; bulk-mode resonator design; frequency 5.1 MHz; gain 15 dB; gain 65 dB; heater separation; high-Q SiO2-polysilicon structural material; low-insertion-loss filter; low-phase-noise oscillator; low-voltage CMOS-microelectromechanical system thermal-piezoresistive resonator; piezoresistive sensing; quality factor; routing flexibility; size 0.35 mum; standard 2-poly-4-metal CMOS process; stopband rejection; CMOS integrated circuits; Heating; Materials; Micromechanical devices; Piezoresistance; Thermal resistance; Thermal stability; $Q$ factor; CMOS-MEMS; Micro-electro-mechanical System; Micro-resonators; Piezoresistive device Thermal stability; Q factor; Thermo-elasticity; micro-resonators; microelectromechanical system; piezoresistive device thermal stability; thermo-elasticity;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2014.2382553