• DocumentCode
    1762434
  • Title

    Parameter Extraction and Comparison of Self-Heating Models for Power MOSFETs Based on Transient Current Measurements

  • Author

    Koh, R. ; Iizuka, Tetsuya

  • Author_Institution
    Technol. Dev. Unit, Renesas Electron. Corp., Kawasaki, Japan
  • Volume
    60
  • Issue
    2
  • fYear
    2013
  • fDate
    Feb. 2013
  • Firstpage
    708
  • Lastpage
    713
  • Abstract
    A self-heating parameter extraction method for a circuit simulation model is discussed based on the transient drain current measurement, by using an 18-V LDMOS as a test device. Important quantities for self-heating models, self-heating-free drain current, thermal resistance Rth, and thermal capacitance Cth are directly and simultaneously extracted from the transient current measurements. The method is efficient in improving the fitting quality in the short-time domain after switching and in guaranteeing the consistency among the extracted quantities. Based on the method, two kinds of thermal network are compared and discussed for the on-wafer measurement. It is demonstrated that the 1R1C model using the method carries fitting errors only in the narrow range of time and that the fitting errors can be removed only by adding one pair of thermal resistance and thermal capacitance which represent the thermal distribution below the device.
  • Keywords
    electric current measurement; power MOSFET; semiconductor device models; thermal resistance; 1R1C model; LDMOS; circuit simulation model; fitting errors; fitting quality; on-wafer measurement; power MOSFET; self-heating model; self-heating parameter extraction method; self-heating-free drain current; short-time domain; thermal capacitance; thermal distribution; thermal network; thermal resistance; transient drain current measurement; voltage 18 V; Current measurement; Integrated circuit modeling; Parameter extraction; Pulse measurements; Steady-state; Thermal resistance; Transient analysis; Circuit simulation; SPICE; heating; power MOSFET; power dissipation; semiconductor device modeling;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2012.2226727
  • Filename
    6387590