DocumentCode
1762624
Title
Analysis of Charge-Pumping Data for Identification of Dielectric Defects
Author
Veksler, Dekel ; Bersuker, Gennadi ; Koudymov, Alexey ; Liehr, Michael
Author_Institution
SEMATECH, Albany, NY, USA
Volume
60
Issue
5
fYear
2013
fDate
41395
Firstpage
1514
Lastpage
1522
Abstract
We introduce a data analysis methodology for multifrequency charge-pumping (CP) measurements, which allows extracting both spatial and energy profiles of the CP-active traps in the gate dielectrics along with the defect energy characteristics. The analysis is based on the charge trapping/detrapping model accounting for carriers tunneling between the substrate and the oxide traps and multiphonon-assisted structural trap relaxation associated with charge carrier localization in the trap. Comparison of the spatial and energy trap distribution profiles obtained from CP data collected on a set of high-k dielectric gate stacks of different thicknesses facilitate the calibration of the model parameters. Extraction of the bulk trap characteristics, including trap ionization and relaxation energies, extends the utility of the CP technique from quantifying defect density toward identifying the nature of defects in the dielectric.
Keywords
charge pump circuits; dielectric materials; tunnelling; CP-active traps; bulk trap characteristics; carriers tunneling; charge carrier localization; charge trapping/detrapping model; charge-pumping data; data analysis methodology; defect density; defect energy characteristics; dielectric defects; energy profile; energy trap distribution profiles; gate dielectrics; high-k dielectric gate stacks; model parameters; multifrequency charge-pumping measurements; multiphonon-assisted structural trap relaxation; oxide trap; relaxation energies; spatial profile; substrate trap; trap ionization; Dielectrics; Electron traps; Erbium; Logic gates; Substrates; Wave functions; Charge pumping; defect profiling; multiphonon processes; structural defect relaxation;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2013.2249070
Filename
6482190
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