Title :
Low Temperature Irreversible Poly(DiMethyl) Siloxane Packaging of Silanized SU8 Microchannels: Characterization and Lab-on-Chip Application
Author :
Hamdi, Feriel S. ; Woytasik, Marion ; Couty, Magdalena ; Francais, Olivier ; Le Pioufle, Bruno ; Dufour-Gergam, E.
Author_Institution :
Ecole Normale Super. de Cachan, Cachan, France
Abstract :
In this paper, we describe and characterize a novel method, based on silanization, for strong bonding of SU8 microchannels to poly(dimethyl)siloxane (PDMS) flexible covers. First, the SU8 surface treatment process (silanization) is characterized through atomic force microscopy and contact angle measurements. The aging study proves grafting stability during more than two days. Silanized SU8 patterns and PDMS cover are finally bonded to seal the microchannel network. Such assembled microdevices can be used without leakage at flow rates above 2.4 mL/min, corresponding to 1.2 MPa if the PDMS deformation is neglected. The bonding tensile pressure exceeds 1.5 MPa, proving the packaging strength. Furthermore, SU8-PDMS composite devices display stable bonding after several weeks of storage. This rapid low cost and low temperature bonding technique is finally successfully employed to fabricate a fully packaged biochip for electric and fluidic handling of biological cells.
Keywords :
atomic force microscopy; bioMEMS; contact angle; lab-on-a-chip; microchannel flow; packaging; PDMS flexible covers; atomic force microscopy; biochip; biological cells; contact angle measurement; grafting stability; lab-on-chip application; low temperature bonding technique; low temperature irreversible poly(dimethyl) siloxane packaging; silanization; silanized SU8 microchannels; Bonding; Packaging; Plasmas; Rough surfaces; Surface roughness; Surface topography; Surface treatment; Contact angle; Poly(DiMethyl)Siloxane (PDMS); lab-on-chip; microfluidics; packaging; silanization; silanization.;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2014.2331454
