DocumentCode
1763364
Title
A Monolithic Polyimide Micro Cryogenic Cooler: Design, Fabrication, and Test
Author
Yunda Wang ; Lewis, R. ; Radebaugh, R. ; Lin, Martin M.-H ; Bright, V.M. ; Yung-Cheng Lee
Author_Institution
Palo Alto Res. Center, Palo Alto, CA, USA
Volume
23
Issue
4
fYear
2014
fDate
Aug. 2014
Firstpage
934
Lastpage
943
Abstract
In this paper, we present the design, fabrication, and testing of a monolithic polymer Joule-Thomson microcryogenic cooler (MCC) cold stage. The MCC cold stages were fabricated monolithically on a wafer out of polyimide. The fabrication was based on surface micromachining technologies using electroplated copper as the sacrificial layers and polyimide as the structural material. The process consisted of multilayers of metallization, coating of polyimide, and the patterning on each layer. One of the key techniques enabling this monolithic approach was the development of the wafer-level 3-D interconnect for making high pressure (e.g., 10 atm) polymer fluid microchannels. To evaluate the performance of the MCC, a five-component fluid mixture designed for cooling from 300 to 200 K was used as a refrigerant. The cold tip reached 190 K under a refrigerant pressure ratio of 6.2:1.1 bar. The heat-lift at 200 K was measured to be 5.2 mW.
Keywords
cryogenics; microchannel plates; micromachining; micromechanical devices; MCC cold stages; electroplated copper; five-component fluid mixture; monolithic polymer Joule-Thomson microcryogenic cooler cold stage; polymer fluid microchannels; surface micromachining technology; temperature 300 K to 200 K; wafer-level 3-D interconnect; Cryogenics; Heat transfer; Heating; Polyimides; Refrigerants; Silicon; Valves; 3-D interconnect; Micro cryogenic cooler; fluid micro channels; mixed refrigerant; monolithic; polyimide; wafer-level process; wafer-level process.;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2014.2301631
Filename
6739075
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