• DocumentCode
    1763364
  • Title

    A Monolithic Polyimide Micro Cryogenic Cooler: Design, Fabrication, and Test

  • Author

    Yunda Wang ; Lewis, R. ; Radebaugh, R. ; Lin, Martin M.-H ; Bright, V.M. ; Yung-Cheng Lee

  • Author_Institution
    Palo Alto Res. Center, Palo Alto, CA, USA
  • Volume
    23
  • Issue
    4
  • fYear
    2014
  • fDate
    Aug. 2014
  • Firstpage
    934
  • Lastpage
    943
  • Abstract
    In this paper, we present the design, fabrication, and testing of a monolithic polymer Joule-Thomson microcryogenic cooler (MCC) cold stage. The MCC cold stages were fabricated monolithically on a wafer out of polyimide. The fabrication was based on surface micromachining technologies using electroplated copper as the sacrificial layers and polyimide as the structural material. The process consisted of multilayers of metallization, coating of polyimide, and the patterning on each layer. One of the key techniques enabling this monolithic approach was the development of the wafer-level 3-D interconnect for making high pressure (e.g., 10 atm) polymer fluid microchannels. To evaluate the performance of the MCC, a five-component fluid mixture designed for cooling from 300 to 200 K was used as a refrigerant. The cold tip reached 190 K under a refrigerant pressure ratio of 6.2:1.1 bar. The heat-lift at 200 K was measured to be 5.2 mW.
  • Keywords
    cryogenics; microchannel plates; micromachining; micromechanical devices; MCC cold stages; electroplated copper; five-component fluid mixture; monolithic polymer Joule-Thomson microcryogenic cooler cold stage; polymer fluid microchannels; surface micromachining technology; temperature 300 K to 200 K; wafer-level 3-D interconnect; Cryogenics; Heat transfer; Heating; Polyimides; Refrigerants; Silicon; Valves; 3-D interconnect; Micro cryogenic cooler; fluid micro channels; mixed refrigerant; monolithic; polyimide; wafer-level process; wafer-level process.;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2014.2301631
  • Filename
    6739075