Thermal Performance of Data Centers-Rack Level Analysis

Author

Fakhim, B. ; Srinarayana, N. ; Behnia, M. ; Armfield, S.W.

Author_Institution

Sch. of Aerosp., Mech., & Mechatron. Eng., Univ. of Sydney, Sydney, NSW, Australia

Volume

3

Issue

5

fYear

2013

fDate

41395

Firstpage

792

Lastpage

799

Abstract

This paper analyzes the thermal performance of a data center on a rack level, by utilizing racks stocked with 1U servers. Eleven different rack models covering a wide range of server arrangements with void spaces are presented and modeled in a raised-floor configuration. The objective is to investigate the thermal performance of semipopulated racks with different server arrangements. The inlet and outlet temperature profiles of the models are presented and the overall effect of each model on the thermal performance of a specific rack is discussed. Findings point toward the detailed modeling of semipopulated racks to investigate the main locations of the temperature spikes adjacent to the rack inlet and outlets as well as the recirculation zones.

Keywords

computer centres; cooling; file servers; 1U servers; data centers-rack level analysis; inlet temperature profiles; outlet temperature profiles; rack models; raised-floor configuration; recirculation zones; semipopulated racks; server arrangements; temperature spikes; thermal performance; Atmospheric modeling; Cooling; Heating; Layout; Servers; Temperature measurement; Thermal analysis; Cooling; data center; rack level analysis; thermal performance;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2013.2248195

Filename

6482604