DocumentCode :
1764070
Title :
Thermal Performance of Data Centers-Rack Level Analysis
Author :
Fakhim, B. ; Srinarayana, N. ; Behnia, M. ; Armfield, S.W.
Author_Institution :
Sch. of Aerosp., Mech., & Mechatron. Eng., Univ. of Sydney, Sydney, NSW, Australia
Volume :
3
Issue :
5
fYear :
2013
fDate :
41395
Firstpage :
792
Lastpage :
799
Abstract :
This paper analyzes the thermal performance of a data center on a rack level, by utilizing racks stocked with 1U servers. Eleven different rack models covering a wide range of server arrangements with void spaces are presented and modeled in a raised-floor configuration. The objective is to investigate the thermal performance of semipopulated racks with different server arrangements. The inlet and outlet temperature profiles of the models are presented and the overall effect of each model on the thermal performance of a specific rack is discussed. Findings point toward the detailed modeling of semipopulated racks to investigate the main locations of the temperature spikes adjacent to the rack inlet and outlets as well as the recirculation zones.
Keywords :
computer centres; cooling; file servers; 1U servers; data centers-rack level analysis; inlet temperature profiles; outlet temperature profiles; rack models; raised-floor configuration; recirculation zones; semipopulated racks; server arrangements; temperature spikes; thermal performance; Atmospheric modeling; Cooling; Heating; Layout; Servers; Temperature measurement; Thermal analysis; Cooling; data center; rack level analysis; thermal performance;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2013.2248195
Filename :
6482604
Link To Document :
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