Title :
Reliable Space-Mapping Optimization Integrated With EM-Based Adjoint Sensitivities
Author :
Koziel, Slawomir ; Ogurtsov, Stanislav ; Bandler, John W. ; Cheng, Qingsha S.
Author_Institution :
Eng. Optimization & Modeling Center, Reykjavik Univ., Reykjavik, Iceland
Abstract :
We present a robust space mapping (SM) algorithm exploiting electromagnetic (EM)-based adjoint sensitivities for microwave design optimization. Our approach utilizes low-cost EM-based adjoint sensitivities and trust region methods to improve an SM algorithm at three levels, which are: 1) to build a better overall surrogate while ensuring convergence; 2) to speed up and safeguard the parameter extraction steps; and 3) to speed up and safeguard the surrogate optimization process. We describe the implementation at each level in detail. We review relevant adjoint sensitivity analysis methods. We also review prior SM methods that exploit both sensitivity and adjoint sensitivity. We summarize these methods in four categories. We compare our proposed approach with them. Efficiency, robustness, and versatility of our method are demonstrated by three design examples: an antenna, a planar filter, and a 3-D resonator filter. We compare the results with those obtained by SM without using adjoint sensitivity information and by direct optimization of the high-fidelity EM models.
Keywords :
computational electromagnetics; microwave devices; microwave propagation; optimisation; EM-based adjoint sensitivity analysis; SM algorithm; electromagnetic design; high fidelity EM model; low fidelity EM model; microwave design optimization; parameter extraction; reliable space mapping optimization; surrogate optimization process; trust region method; Computational modeling; Convergence; Integrated circuit modeling; Optimization; Parameter extraction; Sensitivity; Solid modeling; Adjoint sensitivity; computer-aided design (CAD); electromagnetic (EM)-driven design; optimization; space mapping (SM); surrogate modeling;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2013.2278148