• DocumentCode
    1764437
  • Title

    Effects of interface bonding on acoustic wave generation in an elastic body by surface-mounted piezoelectric transducers

  • Author

    Peng Li ; Feng Jin ; Weiqiu Chen ; Jiashi Yang

  • Author_Institution
    State Key Lab. for Mech. Struct. Strength & Vibration, Xi´an Jiaotong Univ., Xi´an, China
  • Volume
    60
  • Issue
    9
  • fYear
    2013
  • fDate
    Sep. 2013
  • Firstpage
    1957
  • Lastpage
    1963
  • Abstract
    We study the effects of interface bonding on acoustic wave generation in an elastic body using surface-mounted piezoelectric transducers driven electrically. A theoretical analysis is performed based on a physical model of a piezoelectric layer on an elastic substrate. The transducer-substrate interface is described by the shear-slip model, representing a viscoelastic interface. Different from the results in the literature on free vibrations of structures with weak interfaces, this paper presents an electrically forced vibration analysis. An analytical solution for the generated acoustic wave is obtained and used to calculate its energy flux and the efficiency of the transduction. The effects of the interface parameters are examined. It is found that the interface bonding affects the performance of the transducer in multiple ways, some of which may be exploitable in designs for better transducer performance. In particular, optimal transduction is not necessarily associated with a perfectly bonded interface.
  • Keywords
    piezoelectric transducers; substrates; vibrations; viscoelasticity; acoustic wave generation; elastic body; energy flux; free vibrations; interface bonding; shear slip model; surface mounted piezoelectric transducer; transducer-substrate interface; transduction efficiency; viscoelastic interface; Acoustic waves; Admittance; Bonding; Resonant frequency; Substrates; Transducers; Vibrations;
  • fLanguage
    English
  • Journal_Title
    Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-3010
  • Type

    jour

  • DOI
    10.1109/TUFFC.2013.2780
  • Filename
    6587404