DocumentCode :
1764451
Title :
Impact of Residual Hardmask Wires on the Performance of Film-Profile-Engineered ZnO Thin-Film Transistors With Discrete Bottom Gates
Author :
Rong-Jhe Lyu ; Horng-Chih Lin ; Tiao-Yuan Huang
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume :
36
Issue :
8
fYear :
2015
fDate :
Aug. 2015
Firstpage :
796
Lastpage :
798
Abstract :
Root cause for the anomalous degradation in the ON-current of film-profile-engineered ZnO thin-film transistors with discrete bottom gates, a new scheme proposed in our previous work, is investigated. Our findings indicate that the deposited source/drain (S/D) metal contact pads are disconnected owing to two TiN wires hung over the S/D regions, which are unintentionally formed during the fabrication of devices. The disconnected S/D metal contacts cause an increase in the S/D series resistance, and thus, the ON-current is degraded. Several ways for addressing this issue are proposed in this letter, including the simple thinning of gate electrode. As the undesirable TiN wires are eliminated, the devices demonstrate enhanced field-effect mobility and uniformity in performance.
Keywords :
electrodes; semiconductor device manufacture; semiconductor device testing; thin film transistors; titanium compounds; zinc compounds; ON-current; S-D metal contact pads; S-D series resistance; TiN; ZnO; discrete bottom gates; field-effect mobility; film-profile-engineered thin-film transistors; gate electrode; residual hardmask wires; source-drain metal contact pads; Films; II-VI semiconductor materials; Logic gates; Thin film transistors; Tin; Wires; Zinc oxide; Metal oxides; ZnO; film profile engineering (FPE); thin-film transistor;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2015.2445772
Filename :
7124440
Link To Document :
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