Title : 
An Expandable 
 
  Liner Stressor for N-Channel FinFETs
 
         
        
            Author : 
Yinjie Ding ; Qian Zhou ; Bin Liu ; Gyanathan, Ashvini ; Yee-Chia Yeo
         
        
            Author_Institution : 
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
         
        
        
        
        
        
        
        
            Abstract : 
We report the demonstration of a novel ZnS-SiO2 liner stressor to enhance drive current in Si n-channel FinFETs (N-FinFETs). ZnS-SiO2 expands during thermal anneal due to an increase in crystallite size. A ZnS-SiO2 liner stressor wrapping around an N-FinFET can be expanded and made to exert high tensile stress in the N-FinFET channel for drive current enhancement. Saturation drain current enhancement of ~26% and linear drain current enhancement of ~48% were observed for FinFETs with ZnS-SiO2 liner stressor compared with control FinFETs without ZnS-SiO2, with no compromise on short-channel effects. The drain current enhancement increases with decreasing gate length. This technology was realized in FinFETs with silicon-carbon source/drain stressors and Al-incorporated NiSi contacts. ZnS-SiO2 liner stressor could be a strain engineering option for N-FinFETs at sub-20-nm technology nodes.
         
        
            Keywords : 
II-VI semiconductors; MOSFET; silicon compounds; stress effects; zinc compounds; N-FinFET; N-channel FinFET; NiSi:Al; ZnS-SiO2; drain stressors; drive current; linear drain current; liner stressor; saturation drain current; short-channel effects; strain engineering option; tensile stress; thermal annealling; Annealing; FinFETs; Logic gates; Silicon; Strain; Tensile stress; ${rm ZnS}hbox{-}{rm SiO}_{2}$; Expansion; ZnS-SiO₂.; liner stressor; multigate FET; n-channel FinFET (N-FinFET); strain;
         
        
        
            Journal_Title : 
Electron Devices, IEEE Transactions on
         
        
        
        
        
            DOI : 
10.1109/TED.2014.2317717