Title :
Fast Transient Analysis of Tightly Coupled Interconnects via Overlapping Partitioning and Model-Order Reduction
Author :
Farhan, Mohd Aliff ; Nakhla, Natalie M. ; Nakhla, Michel S. ; Achar, Ramachandra
Author_Institution :
Dept. of Electron., Carleton Univ., Ottawa, ON, Canada
Abstract :
The presence of a large number of interconnects in high-speed circuits is a major bottleneck for the fast simulation of such circuits. Iterative approaches, such as waveform relaxation (WR) methods, were proposed to allow fast analysis of highspeed interconnects. In the case of strong coupling between the lines, overlapping partitioning (OP) techniques were proposed to speedup the convergence rate of WR methods, wherein the methods, the Multi Transimission Lines are partitioned such that the strongly coupled lines are in the same subcircuit. However, in the case of increasing the number of overlapping lines, the simulation efficiency can suffer due to the increasing size of each subcircuit. In this paper, an accelerated OP method is proposed. The proposed method uses model-order reduction techniques (MOR) to obtain a reduced model for the partitioned subcircuits allowing for fast simulation in each iteration, thus providing a speedup in the overall simulation time. Also, a new method is presented for efficient updating of relaxation sources while using MOR.
Keywords :
convergence; interconnections; transmission lines; MOR; WR methods; accelerated OP method; convergence rate; fast transient analysis; high-speed circuits; model-order reduction techniques; multitransmission lines; overlapping lines; overlapping partitioning; relaxation sources; tightly coupled interconnects; waveform relaxation methods; Convergence; Couplings; Equations; Integrated circuit interconnections; Integrated circuit modeling; Mathematical model; Ports (Computers); High speed interconnects; model-order reduction (MOR); overlapping partitioning (OP); transient analysis; transverse partitioning (TP); waveform relaxation (WR); waveform relaxation (WR).;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2014.2331348