DocumentCode :
17651
Title :
Plasmonic Coupler for Silicon-Based Micro-Slabs to Plasominc Nano-Gap Waveguide Mode Coversion Enhancement
Author :
Liu, Yanbing ; Lai, Y. ; Chang, Kuo-Pin
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas A&M Univ., College Station, TX, USA
Volume :
31
Issue :
11
fYear :
2013
fDate :
1-Jun-13
Firstpage :
1708
Lastpage :
1712
Abstract :
We investigate a short (~1.5 μm) “partially” corrugated tapered waveguide for silicon-based micro-slab waveguide to plasmonic nano-gap waveguide mode conversion at the optical communication frequency. The structure is designed to achieve more precise mode matching between the silicon slabs and plasmonic waveguides. High transmission efficiencies up to 87%~98% have been demonstrated numerically. The results show that the corrugated structure should not only be helpful for realizing full on-chip silicon plasmonic devices but also a good choice for mode coupling enhancement from dielectric waveguides to plasmonic waveguides. Meanwhile, we point out that the coupling mechanism reported here is different from that achieved by exciting surface plasmon polaritions (SPPs) at metal surfaces reported in the literature [18], [19].
Keywords :
integrated optics; nanophotonics; optical couplers; optical waveguides; plasmonics; polaritons; Si; corrugated structure; coupling mechanism; dielectric waveguides; full on-chip silicon plasmonic devices; metal surfaces; mode coupling enhancement; mode matching; optical communication frequency; partially corrugated tapered waveguide; plasmonic coupler; plasmonic nanogap waveguide mode conversion enhancement; silicon slabs; silicon-based microslab waveguide; surface plasmon polaritions; transmission efficiencies; Couplings; Optical waveguides; Plasmons; Silicon; Slabs; Waveguide discontinuities; Couplers; plasmonic coupler; plasmonic wave guides; silicon based plasmonic coupler; silicon photonics;
fLanguage :
English
Journal_Title :
Lightwave Technology, Journal of
Publisher :
ieee
ISSN :
0733-8724
Type :
jour
DOI :
10.1109/JLT.2013.2257686
Filename :
6497449
Link To Document :
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