• DocumentCode
    1765786
  • Title

    A Novel Approach for Modeling Near-Field Coupling With PCB Traces

  • Author

    Shall, H. ; Riah, Z. ; Kadi, Moncef

  • Author_Institution
    Res. Inst. for Embedded Syst. (IRSEEM/ESIGELEC), Rouen, France
  • Volume
    56
  • Issue
    5
  • fYear
    2014
  • fDate
    Oct. 2014
  • Firstpage
    1194
  • Lastpage
    1201
  • Abstract
    This paper presents a novel modeling approach for predicting the response of a printed circuit board (PCB) trace excited by a nonuniform electromagnetic (EM) radiated field from complex electronic components. The proposed approach is analytic and it is based on transmission line model with distributed sources taking into account the effect of the effective relative permittivity εreff of the PCB surrounding medium. The modeling procedure is a two-step approach: three-dimensional radiated emission modeling of the electronic component, source of EM disturbance, and using a set of equivalent sources followed by the computation of the induced voltages in the trace terminals referring to analytic coupling formulations. Comparison between modeled, numerical, and measured results enables us to validate the proposed model.
  • Keywords
    electromagnetic coupling; electromagnetic interference; equivalent circuits; microstrip lines; permittivity; printed circuits; transmission lines; 3D radiated emission modeling; analytic coupling formulations; effective relative permittivity; near-field coupling modeling; nonuniform electromagnetic radiated field; printed circuit board traces; trace terminals; transmission line model; Atmospheric modeling; Couplings; Integrated circuit modeling; Mathematical model; Microstrip; Solid modeling; Substrates; Coupling formulations; electromagnetic interferences (EMIs); near-field measurement; printed circuit board (PCB) traces; three-dimensional radiated emission;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2014.2304306
  • Filename
    6740079