DocumentCode :
1766328
Title :
Influence regularity of trace O6 on SF6 decomposition characteristics and its mathematical amendment under partial discharge
Author :
Ju Tang ; Fuping Zeng ; Xiaoxing Zhang ; Jianyu Pan ; Yinjun Qiu ; Yan Liu ; Jingfan Yuan
Author_Institution :
State Key Lab. of Power Transm. Equip. & Syst. Security & New Technol., Chongqing, China
Volume :
21
Issue :
1
fYear :
2014
fDate :
41671
Firstpage :
105
Lastpage :
115
Abstract :
In order to build a solid engineering application foundation when using decomposed characteristic components to identify the internal insulation faults of SF6 electrical equipment, this paper conducted serials of experiment about the influence of different trace O2 on SF6 decomposed components. The variation regularity of the accumulative concentration, relative formation rate, and ratio of the characteristic component (CF4, CO2, SO2F2, and SOF2) with changing time was investigated. The dynamics theory of the chemical reaction was exploited to analyze the influence regularity of O2 on the characteristic components. A mathematical model about the influence of O2 on the characteristic ratio (C(CF4)/C(CO2), CCF4+CO2)/C(SOF2+SO2F2) and C(SO2F2)/C(SOF2)) was established. The results show that: the accumulative concentration and relative formation rate of CF4, CO2, SO2F2, and SOF2 changes with the content of different trace O2, but each variation regularity is different. As a result, it leads to different variation regularity of characteristic ratios. Besides, power function can depict the influence regularity of trace O2 on the characteristic ratios and adjust the SF6 decomposition characteristics of different O2 content to a comparable standard, which can lay theoretical basis for diagnosing the insulation defects of the SF6 electrical equipment.
Keywords :
insulating materials; partial discharges; CF4; SF6; SO2F2; SOF2; accumulative concentration variation regularity; internal insulation faults; partial discharge; Discharges (electric); Electrodes; Fault diagnosis; Partial discharges; Sulfur hexafluoride; Water; Partial discharge; SF6; decomposition characteristic; influence regularity; mathematical amendment.; trace O2;
fLanguage :
English
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9878
Type :
jour
DOI :
10.1109/TDEI.2013.003795
Filename :
6740731
Link To Document :
بازگشت