DocumentCode
1766328
Title
Influence regularity of trace O6 on SF6 decomposition characteristics and its mathematical amendment under partial discharge
Author
Ju Tang ; Fuping Zeng ; Xiaoxing Zhang ; Jianyu Pan ; Yinjun Qiu ; Yan Liu ; Jingfan Yuan
Author_Institution
State Key Lab. of Power Transm. Equip. & Syst. Security & New Technol., Chongqing, China
Volume
21
Issue
1
fYear
2014
fDate
41671
Firstpage
105
Lastpage
115
Abstract
In order to build a solid engineering application foundation when using decomposed characteristic components to identify the internal insulation faults of SF6 electrical equipment, this paper conducted serials of experiment about the influence of different trace O2 on SF6 decomposed components. The variation regularity of the accumulative concentration, relative formation rate, and ratio of the characteristic component (CF4, CO2, SO2F2, and SOF2) with changing time was investigated. The dynamics theory of the chemical reaction was exploited to analyze the influence regularity of O2 on the characteristic components. A mathematical model about the influence of O2 on the characteristic ratio (C(CF4)/C(CO2), CCF4+CO2)/C(SOF2+SO2F2) and C(SO2F2)/C(SOF2)) was established. The results show that: the accumulative concentration and relative formation rate of CF4, CO2, SO2F2, and SOF2 changes with the content of different trace O2, but each variation regularity is different. As a result, it leads to different variation regularity of characteristic ratios. Besides, power function can depict the influence regularity of trace O2 on the characteristic ratios and adjust the SF6 decomposition characteristics of different O2 content to a comparable standard, which can lay theoretical basis for diagnosing the insulation defects of the SF6 electrical equipment.
Keywords
insulating materials; partial discharges; CF4; SF6; SO2F2; SOF2; accumulative concentration variation regularity; internal insulation faults; partial discharge; Discharges (electric); Electrodes; Fault diagnosis; Partial discharges; Sulfur hexafluoride; Water; Partial discharge; SF6; decomposition characteristic; influence regularity; mathematical amendment.; trace O2;
fLanguage
English
Journal_Title
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher
ieee
ISSN
1070-9878
Type
jour
DOI
10.1109/TDEI.2013.003795
Filename
6740731
Link To Document