Title :
ESD protection design for microwave/millimeter wave low-noise amplifiers
Author :
Ming-Hsien Tsai ; Hsu, Shawn S. H.
Author_Institution :
Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
Different ESD design topologies suitable for microwave/millimeter wave low-noise amplifiers (LNAs) are reviewed, and the design tradeoffs and limitations of each topology are also discussed. In addition, a V-band LNA using the proposed Pi-type ESD block is demonstrated in 65-nm CMOS. A series ESD inductor together with two shunt ESD diodes and an bonding (probing) pad form a Pi-type network, acting like an ideal wideband 50-ohm transmission line with a loss of only 0.6 dB at 60 GHz. Under a power consumption of 27 mW, the ESD-protected LNA presents a 4.1-dB NF and 18.5-dB power gain at 60 GHz, respectively with a 3-dB bandwidth up to 7.7 GHz. The measured results also demonstrate a 2.5-kV Human-Body-Model (HBM) ESD protection. This LNA shows excellent FoMs compared with recently published results in a similar frequency range.
Keywords :
CMOS analogue integrated circuits; MMIC amplifiers; electrostatic discharge; field effect MIMIC; field effect MMIC; integrated circuit design; low noise amplifiers; ESD design topologies; ESD protection design; FoMs; HBM ESD protection; LNAs; Pi-type ESD block; Pi-type network; V-band LNA; bonding pad; frequency 60 GHz; gain 18.5 dB; human-body-model; ideal wideband transmission line; loss 0.6 dB; microwave low-noise amplifiers; millimeter wave low-noise amplifiers; noise figure 4.1 dB; power 27 mW; resistance 50 ohm; series ESD inductor; shunt ESD diodes; size 65 nm; voltage 2.5 kV; CMOS integrated circuits; Electrostatic discharges; Low-noise amplifiers; Noise measurement; Radio frequency; Topology; Transmission line measurements; CMOS; electrostatic discharge (ESD); human body model (HBM); low-noise amplifier (LNA); microwave; millimeter wave (mm-wave);
Conference_Titel :
Wireless Symposium (IWS), 2014 IEEE International
Conference_Location :
X´ian
DOI :
10.1109/IEEE-IWS.2014.6864242