• DocumentCode
    1766784
  • Title

    A full Ka-band waveguide-based spatial power-combining amplifier using e-plane anti-phase probes

  • Author

    Kang Yin ; Jin Pin Xu ; Zheng Hua Chen

  • Author_Institution
    State Key Lab. of Millimeter Waves, Southeast Univ., Nanjing, China
  • fYear
    2014
  • fDate
    24-26 March 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A full Ka-band solid-state power amplifier has been presented and designed using a waveguide-based spatial power-combining technique based on E-plane anti-phase probes. The power divider/combiner employed in this design provides not only a high power-combining efficiency over a full waveguide bandwidth, but also efficient heat sinking for the active power devices. A simple design approach for the power divider/combiner has been developed. The measured insertion loss of the power divider/combiner is less than 0.25dB across the 26-40GHz band. The measured output saturated power of the solidstate amplifier is higher than 27.5dbm over the entire Ka-band. The obtained power-combining efficiency is from 83% to 90% in this frequency band. These results indicate that the proposed power-combining scheme is suitable for implementation of low cost, broadband power amplifiers operating at millimeter wave frequency.
  • Keywords
    heat sinks; millimetre wave power amplifiers; power combiners; power dividers; wideband amplifiers; active power devices; broadband power amplifiers; e-plane antiphase probes; efficiency 83 percent to 90 percent; frequency 26 GHz to 40 GHz; full Ka-band solid-state power amplifier; heat sinking; millimeter wave frequency; power divider; waveguide-based spatial power-combining technique; Loss measurement; Microstrip; Millimeter wave technology; Power amplifiers; Power dividers; Power measurement; Probes; Combining efficiency; Full ka-band; Power amplifiers; Solid-state; Spatial power combining;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Symposium (IWS), 2014 IEEE International
  • Conference_Location
    X´ian
  • Type

    conf

  • DOI
    10.1109/IEEE-IWS.2014.6864257
  • Filename
    6864257