Title :
Orthogonal wideband (DC-10 GHz) microstrip-to-microstrip transition using flexible LCP interconnects
Author :
McQuaide, Dylan ; Khan, Wasif ; Guidoni, Luca ; Ruzzene, Massimo ; Papapolymerou, John
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper presents an orthogonal, broadband microstrip-to-microstrip RF transition at the board level. The transition was achieved by bonding a single metal trace fabricated on Rogers Ultralam 3850 Liquid Crystal Polymer (LCP) substrate to microstrip lines made on RO3003 substrates. 3D FEM simulations in Ansoft HFSS and measured data show that S21 for this transition is less than 1 dB over a wide range of frequencies from DC-9.5 GHz. The insertion loss per unit length remains below 0.5 dB/cm below approximately 10 GHz.
Keywords :
finite element analysis; flexible electronics; liquid crystal polymers; microstrip lines; microstrip transitions; substrates; 3D FEM simulation; Ansoft HFSS; RO3003 substrate; Rogers Ultralam 3850; flexible LCP interconnect; insertion loss; liquid crystal polymer substrate; microstrip line; orthogonal wideband microstrip-to-microstrip RF transition; Broadband communication; Connectors; Integrated circuit interconnections; Loss measurement; Microstrip; Radio frequency; Substrates; LCP; Orthogonal Interconnect; broadband interconnect;
Conference_Titel :
Microwave Conference (EuMC), 2014 44th European
Conference_Location :
Rome
DOI :
10.1109/EuMC.2014.6986803
