DocumentCode
1768200
Title
An 1.61mW mixed-signal column processor for BRISK feature extraction in CMOS image sensor
Author
Kyeongryeol Bong ; Gyeonghoon Kim ; Injoon Hong ; Hoi-Jun Yoo
Author_Institution
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea
fYear
2014
fDate
1-5 June 2014
Firstpage
57
Lastpage
60
Abstract
In mobile object recognition (OR) applications, the power consumption of image sensor and data communication between image sensor and digital OR processor becomes crucial as digital OR processor consumes less power in deep sub-micron process. To reduce the amount of data transaction from image sensor to digital OR processor, digital/analog mixed-signal focal-plane processing of Binary Robust Invariant Scalable Keypoints (BRISK) feature extraction in CMOS image sensor (CIS) is proposed. The proposed CIS processor sends BRISK feature vectors instead of the whole image pixel data, resulting in 79% reduction of data communication. In this work, mixed-signal processing of corner detection and successive approximation register (SAR)-based scoring are implemented for BRISK feature point detection. To achieve scale-invariance in object recognition, scale-space is generated and stored in analog line memory. In addition, noise reduction scheme is integrated in column processing chain to remove salt and pepper noise, which degrades recognition accuracy. In a post layout simulation, the proposed system achieves 0.70pW/pixel*frame*feature at 30fps in a 130nm CMOS technology, which is 13.6% lower than the state-of-the-art.
Keywords
CMOS image sensors; data communication; digital signal processing chips; edge detection; feature extraction; focal planes; interference suppression; mixed analogue-digital integrated circuits; object detection; object recognition; BRISK feature extraction; BRISK feature point detection; BRISK feature vector; CIS processor; CMOS image sensor; SAR-based scoring; analog line memory; analog mixed-signal focal plane processing; binary robust invariant scalable keypoint; column processing; corner detection; data communication; data transaction; deep submicron process; digital OR processor; digital mixed-signal focal plane processing; mixed signal column processor; mobile object recognition; noise reduction scheme; power 1.61 mW; power consumption; size 130 nm; successive approximation register; Feature extraction; Filtering; Image resolution; Image sensors; Noise; Object recognition; Vectors;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), 2014 IEEE International Symposium on
Conference_Location
Melbourne VIC
Print_ISBN
978-1-4799-3431-7
Type
conf
DOI
10.1109/ISCAS.2014.6865064
Filename
6865064
Link To Document