DocumentCode
1768361
Title
Selector devices for 3-D cross-point ReRAM
Author
Euijun Cha ; Jiyong Woo ; Daeseok Lee ; Sangheon Lee ; Hyunsang Hwang
Author_Institution
Pohang Univ. of Sci. & Technol. (POSTECH), Pohang, South Korea
fYear
2014
fDate
1-5 June 2014
Firstpage
428
Lastpage
431
Abstract
To integrate cross-point (4F2) ReRAM device array, we need to develop bi-directional selector device to suppress the sneak current path through the unselected devices. Although various candidates with selector properties have been recently reported, several problems such as insufficient current density at set/reset operations for nano-scale devices, low selectivity, and poor endurance have been remained. In this talk, we report two types of selector devices, threshold switching device based on insulator-metal transition (IMT) and multi-layered tunneling oxide device for cross-point ReRAM application. We propose the feasibility for 3-D vertical 1S-1R type ReRAM for future ultra-high density memory applications.
Keywords
metal-insulator boundaries; random-access storage; three-dimensional integrated circuits; tunnelling; 3D cross-point ReRAM device array; 3D vertical 1S-1R type ReRAM; IMT; bidirectional selector device; future ultra-high density memory applications; insulator-metal transition; multilayered tunneling oxide device; selector devices; sneak current path; threshold switching device; Arrays; Current density; Leakage currents; Resistance; Switches; Three-dimensional displays; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), 2014 IEEE International Symposium on
Conference_Location
Melbourne VIC
Print_ISBN
978-1-4799-3431-7
Type
conf
DOI
10.1109/ISCAS.2014.6865157
Filename
6865157
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