• DocumentCode
    1768625
  • Title

    A curvature-compensation technique based on the difference of Si and SiGe junction voltages for bandgap voltage circuits

  • Author

    Yi Huang ; Li Zhu ; Chun Cheung ; Najafizadeh, Laleh

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
  • fYear
    2014
  • fDate
    1-5 June 2014
  • Firstpage
    914
  • Lastpage
    917
  • Abstract
    This paper presents a novel curvature-compensation technique for bandgap reference circuits implemented in Silicon-Germanium (SiGe) BiCMOS technology. The technique utilizes the designer´s access to both Si-based and SiGe-based p-n junctions. Temperature compensation is achieved in two steps: first, by weighted subtraction of two Complementary to Absolute Temperature (CTAT) currents, one proportional to the base-emitter junction of a Si BJT, and the other proportional to that of SiGe HBTs, the non-linear temperature dependent terms are compensated; and second, by adding a Proportional to Absolute Temperature (PTAT) current, the remaining linear temperature dependent terms are canceled. As a result, an almost complete temperature compensation is achieved. Based on this concept, a circuit is designed and simulated in IBM´s SiGe BiCMOS 8HP technology. With a power supply of 2.5 V, simulation results show that the circuit generates an output voltage of 978.5 mV with a temperature coefficient (TC) of 1.0 ppm/°C over the temperature range of -25 °C to 125 °C.
  • Keywords
    BiCMOS integrated circuits; Ge-Si alloys; energy gap; heterojunction bipolar transistors; reference circuits; BJT; BiCMOS technology; HBT; SiGe; bandgap reference circuits; bandgap voltage circuits; base-emitter junction; complementary to absolute temperature currents; curvature-compensation technique; junction voltages; nonlinear temperature; power supply; proportional to absolute temperature current; temperature -25 C to 125 C; temperature compensation; voltage 2.5 V; voltage 978.5 mV; Generators; Junctions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2014 IEEE International Symposium on
  • Conference_Location
    Melbourne VIC
  • Print_ISBN
    978-1-4799-3431-7
  • Type

    conf

  • DOI
    10.1109/ISCAS.2014.6865285
  • Filename
    6865285