DocumentCode
1768807
Title
Examining overlapping community structures within grain property networks
Author
Walker, David M. ; Tordesillas, Antoinette
Author_Institution
Dept. of Math. & Stat., Univ. of Melbourne, Parkville, VIC, Australia
fYear
2014
fDate
1-5 June 2014
Firstpage
1275
Lastpage
1278
Abstract
Granular materials (e.g, geological materials, powders and grains) when subjected to shear or compression deform through grain rearrangements. The structural topology of the grains, or fabric, can be usefully represented as a complex (contact) network whereby network nodes correspond to individual grains and network links correspond to grain contacts. Properties of each node (e.g, degree) can be calculated and throughout deformation this results in time series akin to sensor measurements for each grain in the assembly. These signals can be processed and collated into a particle property network with a corresponding community structure summarizing the relationship between each signal. Different properties give rise to different networks each with their own community structures, i.e, each network possesses the same set of nodes but a different link structure. The overlapping structure of these property network communities is of interest. We describe how the overlapping communities within networks constructed from properties related to grain behaviour with respect to multiscale cyclic structures is consistent with a power law description. Furthermore this behaviour is exhibited across a suite of computer simulations of compression tests which hints at possible universal features in the mechanical response of granular materials.
Keywords
complex networks; granular materials; graph theory; time series; complex network; compression tests; grain behaviour; grain contacts; grain property networks; grain rearrangements; granular materials; mechanical response; multiscale cyclic structures; overlapping community structures; sensor measurements; structural topology; time series; Assembly; Communities; Complex networks; Force; Materials; Time series analysis; Topology;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), 2014 IEEE International Symposium on
Conference_Location
Melbourne VIC
Print_ISBN
978-1-4799-3431-7
Type
conf
DOI
10.1109/ISCAS.2014.6865375
Filename
6865375
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