Thermal cyclic test safety analysis method for astronautic electronic products based on PoF

Thermal cyclic test is very important for astronautic electronic products to stimulate potentially critical failures and eliminate latent defects. The design of the thermal cyclic test should take the safety of test into account to avoid over-test risks. Over-test risks can cause serious consequences, such as unnecessary life cycle consumption and products failure. A method presented in this paper based on PoF can evaluate the over-test risk of the test scheme in life cycle and provide some guidance for the design of the test including temperature range, number of cycles and dwell time. Additionally, aiming at a signal acquisition board, the different schemes were analyzed and some suggestions were offered to modify the scheme.