A case study of the delamination analysis of plastic encapsulated microcircuits based on scanning acoustic microscope inspection

Delamination is a common defect of the Plastic encapsulated microcircuits (PEMs). So, delamination analysis is an important item in Screening, DPA and failure analysis of PEMs. This paper studies the delamination of a buffer in thin shrink small outline package (TSSOP) by using a scanning acoustic microscope (SAM). By using scanning modes of A-scan, B-scan, C-scan and X-scan of the SAM and analysis the result of the scanning, this paper obtained the delamination information of the buffer in detail. At last, this paper summarized a general method of delamination analysis, and the comparison between the method and the traditional method used in Screening, DPA and failure analysis of PEMs is provided.