Title :
A case study of the delamination analysis of plastic encapsulated microcircuits based on scanning acoustic microscope inspection
Author :
Yu Liang ; Sujuan Zhang
Author_Institution :
Sch. of Reliability & Syst. Eng., Beihang Univ., Beijing, China
Abstract :
Delamination is a common defect of the Plastic encapsulated microcircuits (PEMs). So, delamination analysis is an important item in Screening, DPA and failure analysis of PEMs. This paper studies the delamination of a buffer in thin shrink small outline package (TSSOP) by using a scanning acoustic microscope (SAM). By using scanning modes of A-scan, B-scan, C-scan and X-scan of the SAM and analysis the result of the scanning, this paper obtained the delamination information of the buffer in detail. At last, this paper summarized a general method of delamination analysis, and the comparison between the method and the traditional method used in Screening, DPA and failure analysis of PEMs is provided.
Keywords :
acoustic microscopes; buffer circuits; delamination; encapsulation; failure analysis; integrated circuit packaging; integrated circuit reliability; integrated circuits; A-scan; B-scan; C-scan; DPA; X-scan; buffer; delamination analysis; failure analysis; plastic encapsulated microcircuits; scanning acoustic microscope inspection; screening; thin shrink small outline package; Acoustics; Compounds; Delamination; Inspection; Microscopy; Plastics; Reliability; Delamination; PEMS; SAM; TSSOP;
Conference_Titel :
Prognostics and System Health Management Conference (PHM-2014 Hunan), 2014
Conference_Location :
Zhangiiaijie
Print_ISBN :
978-1-4799-7957-8
DOI :
10.1109/PHM.2014.6988161
