DocumentCode :
1769209
Title :
Steady-state thermal analysis and layout optimization of DC/DC converter
Author :
Cheng Gao ; Haitian Liu ; Jiaoying Huang ; Shenglong Diao
Author_Institution :
Sch. of Reliability & Syst. Eng., Beihang Univ., Beijing, China
fYear :
2014
fDate :
24-27 Aug. 2014
Firstpage :
405
Lastpage :
409
Abstract :
DC/DC converters are widely used in industrial, aerospace and other fields. The reliability of DC/DC converters is very important for the whole electronic system. Overheat is the key factor infecting the reliability of DC/DC converters because of the power density of the device. Three-dimensional thermal analysis modules include heat distribution analysis and thermal stress analysis at 25 °C in this paper. In order to obtain power module temperature field contours at different temperature levels, a simplified 3D model of the power module was built, and steady-state thermal analysis was completed. The layout of the converter is optimized to reduce and balance heat distribution according to analysis results. The simulation results indicate that rational distribution of the power supply module can improve the reliability of DC/DC converters significantly.
Keywords :
DC-DC power convertors; optimisation; power supply circuits; power system reliability; thermal stresses; DC-DC converter layout optimization; DC-DC converter reliability; heat distribution reduction; overheat; power density; power module 3D model; power supply module rational distribution; steady-state thermal analysis; temperature 25 degC; thermal stress analysis; Finite element analysis; Heating; Load modeling; Steady-state; Substrates; Temperature distribution; Thermal analysis; DC/DC converters; layout optimization; reliability; steady-state thermal analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Prognostics and System Health Management Conference (PHM-2014 Hunan), 2014
Conference_Location :
Zhangiiaijie
Print_ISBN :
978-1-4799-7957-8
Type :
conf
DOI :
10.1109/PHM.2014.6988203
Filename :
6988203
Link To Document :
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