A novel dimensional analysis method for TSV modeling and analysis in three dimensional integrated circuits

Dimensional analysis is one of the most powerful modeling methods, where it is used to reduce the number of physical variables through combining two or more variables into a single dimension neutral one in order to simplify the process of describing a relationship among those variables. That makes curve fitting to obtain final equations simpler. In this paper, dimensional analysis is applied as a new design methodology for TSV modeling. By using the dimensional analysis and the curve-fitting technique, simple formulas of TSV parameters, such as resistance, capacitance, and inductance are obtained. The results are compared with previous work that model TSVs based on measurements, where excellent agreement is obtained.