DocumentCode :
1770602
Title :
Lightweight materials optimization for EMI protection applications
Author :
Enache, Mihai ; Stoica, D. ; Szilagyi, Andrei
Author_Institution :
Evaluation Sci. Res. Center, Mil. Equip. & Technol. Res. Agency - METRA, Bucharest, Romania
fYear :
2014
fDate :
29-31 May 2014
Firstpage :
1
Lastpage :
4
Abstract :
Nowadays EMI shielding solutions, like most of electronic industry trends, are getting oriented to economical and friendly-environmental technologies. The classical EMI protection solutions consist in standard electromagnetic shielded enclosures designed as the product chassis. The particular situations were classic electronic equipment is placed in a hard EMI environment, are treated by using a special design equipment or a large Faraday enclosure to place the equipment. Both solutions mentioned above involve high costs and sometimes the start date of specific activity is postponed in that hard environment. Our work was to design a special enclosure, using lightweight materials, adapted to equipment in order to maintain product performances and functionality. The technologies analyzed during our studies were represented by conductive coatings and fabrics applied to different types of dielectric substratum by deposition and multi-layer techniques.
Keywords :
Faraday effect; coating techniques; dielectric devices; electromagnetic interference; electromagnetic shielding; optimisation; packaging; EMI protection applications; EMI shielding solutions; Faraday enclosure; conductive coatings; conductive fabrics; deposition technique; dielectric substratum; economical technologies; electromagnetic shielded enclosures; electronic equipment; electronic industry; friendly-environmental technologies; lightweight materials optimization; multilayer technique; Attenuation; Copper; Electromagnetic interference; Frequency measurement; Materials; Testing; EM; EMI; EMSEC; effectiveness attenuation; friendly environment; shielding materials; unconventional;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Communications (COMM), 2014 10th International Conference on
Conference_Location :
Bucharest
Type :
conf
DOI :
10.1109/ICComm.2014.6866710
Filename :
6866710
Link To Document :
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