DocumentCode
1770825
Title
Optical quilt packaging: A new chip-to-chip optical coupling and alignment process for modular sensors
Author
Ahmed, Toufik ; Khan, Adnan Ahmed ; Vigil, Genevieve ; Kulick, Jason M. ; Bernstein, Gary H. ; Hoffman, Anthony J. ; Howard, Scott S.
Author_Institution
Dept. of Electr. Eng., Univ. of Notre Dame, Notre Dame, IN, USA
fYear
2014
fDate
8-13 June 2014
Firstpage
1
Lastpage
2
Abstract
A wide-bandwidth, highly efficient method of inter-chip waveguide coupling suitable for on-chip, mid-infrared sensing is discussed. Simulations and preliminary fabrication work on laser-to-waveguide coupling are presented, with losses predicted to be better than 6 dB.
Keywords
infrared detectors; integrated circuit packaging; integrated optics; optical couplers; optical fabrication; optical losses; optical waveguides; alignment process; chip-to-chip optical coupling; laser-waveguide coupling; modular sensors; on-chip mid-infrared sensing; optical fabrication; optical losses; optical quilt packaging; wide-bandwidth highly efficient interchip waveguide coupling; Couplings; Optical coupling; Optical fiber sensors; Optical waveguides; Quantum cascade lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics (CLEO), 2014 Conference on
Conference_Location
San Jose, CA
Type
conf
Filename
6989119
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