DocumentCode
1770885
Title
Interface properties of n-GaN MIS diodes with ZrO2 /Al2 O3 laminated films as a gate insulator
Author
Kodama, Shintaro ; Tokuda, Hirokuni ; Kuzuhara, Masaaki
Author_Institution
Grad. Sch. of Eng., Univ. of Fukui, Fukui, Japan
fYear
2014
fDate
19-20 June 2014
Firstpage
1
Lastpage
2
Abstract
Interface properties have been investigated for n-GaN MIS diodes. ZrO2/Al2O3 laminated films were used as a gate insulator with varying the deposition sequence of each layer. It was found that the interface state density was decreased with increasing the fraction of Al2O3, and the energy level of the interface state became shallow with increasing the annealing temperature.
Keywords
III-V semiconductors; MIS devices; alumina; gallium compounds; interface states; semiconductor diodes; wide band gap semiconductors; zirconium compounds; GaN; MIS diodes; ZrO2-Al2O3; annealing temperature; deposition sequence; energy level; gate insulator; interface properties; interface state density; laminated films; Aluminum oxide; Annealing; Dielectric constant; Films; Insulators; Interface states; Logic gates; Al2 O3 ; GaN; MIS diode; ZrO2 ;
fLanguage
English
Publisher
ieee
Conference_Titel
Future of Electron Devices, Kansai (IMFEDK), 2014 IEEE International Meeting for
Conference_Location
Kyoto
Print_ISBN
978-1-4799-3614-4
Type
conf
DOI
10.1109/IMFEDK.2014.6867063
Filename
6867063
Link To Document