• DocumentCode
    1770892
  • Title

    Surface charging effects on current stability of AlGaN/GaN HEMTs

  • Author

    Nishiguchi, Kenya ; Hashizume, Tamotsu

  • Author_Institution
    Res. Center for Integrated Quantum Electron., Hokkaido Univ., Sapporo, Japan
  • fYear
    2014
  • fDate
    19-20 June 2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Using a dual-gate transistor structure, we have evaluated the effect of off-bias-stress spatially induced surface charging at the AlGaN/GaN surface. Pulsed voltage stress on the drain access region led only to increase in the on-resistance, whereas the stress on the source region additionally decreased the saturation drain current. In addition, significant surface charging in the access region resulted in a threshold voltage shift. The 2D potential simulation indicated that surface negative charges modulate the potential distribution near the gate edge. It was also found that such surface charging can extend as far as 0.5 μm from the stressing gate edge.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; surface charging; wide band gap semiconductors; 2D potential simulation; AlGaN-GaN; HEMT; current stability; drain access region; dual-gate transistor structure; gate edge; high electron mobility transistors; off-bias-stress spatially induced surface charging; on-resistance; pulsed voltage stress; saturation drain current; source region; surface negative charges; threshold voltage shift; Aluminum gallium nitride; Gallium nitride; HEMTs; Logic gates; MODFETs; Stress; Surface charging; AlGaN; GaN; HEMT; current collapse;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Future of Electron Devices, Kansai (IMFEDK), 2014 IEEE International Meeting for
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4799-3614-4
  • Type

    conf

  • DOI
    10.1109/IMFEDK.2014.6867067
  • Filename
    6867067