Title :
Crack propagation in nonalkaline glass activated by laser-crystallized polycrystalline silicon films
Author :
Hara, Akira ; Goto, Keisuke ; Kitahara, Kuninori
Author_Institution :
Tohoku Gakuin Univ., Tagajo, Japan
Abstract :
We investigated the effect of polycrystalline silicon (poly-Si) films on the mechanical properties of nonalkaline glass (NAG) with regards to crack propagation. 150-nm-thick poly-Si films formed by continuous-wave laser lateral crystallization (CLC) were used as the poly-Si film and indentations intentionally introduced by harness tester were used as source of crack. The cracks propagated only along the laser scan direction, and crack propagation was surprisingly observed at room temperature. Moreover, crack propagation was suppressed after thinning of CLC poly-Si film by wet etching, indicating that the driving force for crack propagation is elastic in nature.
Keywords :
cracks; crystallisation; elasticity; elemental semiconductors; etching; glass; indentation; laser materials processing; semiconductor thin films; silicon; Si-SiO2; continuous-wave laser lateral crystallization; crack propagation; elastic; harness tester; indentation; laser scan direction; laser-crystallized polycrystalline silicon films; mechanical properties; nonalkaline glass; temperature 293 K to 298 K; wet etching; Crystallization; Films; Force; Lasers; Stress; Surface cracks; Temperature measurement;
Conference_Titel :
Active-Matrix Flatpanel Displays and Devices (AM-FPD), 2014 21st International Workshop on
Conference_Location :
Kyoto
DOI :
10.1109/AM-FPD.2014.6867190
