Crack propagation in nonalkaline glass activated by laser-crystallized polycrystalline silicon films

Author

Hara, Akira ; Goto, Keisuke ; Kitahara, Kuninori

Author_Institution

Tohoku Gakuin Univ., Tagajo, Japan

fYear

2014

fDate

2-4 July 2014

Firstpage

265

Lastpage

266

Abstract

We investigated the effect of polycrystalline silicon (poly-Si) films on the mechanical properties of nonalkaline glass (NAG) with regards to crack propagation. 150-nm-thick poly-Si films formed by continuous-wave laser lateral crystallization (CLC) were used as the poly-Si film and indentations intentionally introduced by harness tester were used as source of crack. The cracks propagated only along the laser scan direction, and crack propagation was surprisingly observed at room temperature. Moreover, crack propagation was suppressed after thinning of CLC poly-Si film by wet etching, indicating that the driving force for crack propagation is elastic in nature.

Keywords

cracks; crystallisation; elasticity; elemental semiconductors; etching; glass; indentation; laser materials processing; semiconductor thin films; silicon; Si-SiO₂; continuous-wave laser lateral crystallization; crack propagation; elastic; harness tester; indentation; laser scan direction; laser-crystallized polycrystalline silicon films; mechanical properties; nonalkaline glass; temperature 293 K to 298 K; wet etching; Crystallization; Films; Force; Lasers; Stress; Surface cracks; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Active-Matrix Flatpanel Displays and Devices (AM-FPD), 2014 21st International Workshop on

Conference_Location

Kyoto

Type

conf

DOI

10.1109/AM-FPD.2014.6867190

Filename

6867190