• DocumentCode
    1771746
  • Title

    Application of Laplacian Surface Deformation and self-organizing maps to calculate shape correspondence for statistical shape modeling

  • Author

    Vikas, Karade ; Bhallamudi, Ravi

  • Author_Institution
    Mech. Eng. Dept., Indian Inst. of Technol. - Bombay, Mumbai, India
  • fYear
    2014
  • fDate
    April 29 2014-May 2 2014
  • Firstpage
    369
  • Lastpage
    372
  • Abstract
    This paper presents a pairwise approach of finding shape correspondence for the construction of SSM, applied to distal femur bone. The correspondence was calculated by adapting a representative shape (template mesh) onto the training shapes in two steps. The first step was global registration which involved initial template mesh deformation using Laplacian Surface Deformation (LSD) method guided by a set of uniquely identifiable landmarks. The second step was local shape matching which involved final mesh adaptation using Self-Organizing Maps (SOM) method. Compared to other published methods the landmark correspondence obtained in our method was better (1.1 mm, SD=0.5) with acceptable values of compactness (11 modes), generalization ability (1.6-1.8 mm) and specificity (1.5-2.1 mm).
  • Keywords
    biomechanics; bone; computerised tomography; deformation; image matching; image registration; medical image processing; mesh generation; self-organising feature maps; statistical analysis; CT scans; LSD; Laplacian surface deformation; SOM; SSM; compactness; computerised tomography; distal femur bone; generalization ability; global registration; initial template mesh deformation; local shape matching; mesh adaptation; self-organizing maps; shape correspondence; specificity; statistical shape modeling; Bones; Equations; Laplace equations; Mathematical model; Shape; Three-dimensional displays; Training; Laplacian surface deformation; non-rigid registration; point distribution model; self-organizing maps;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Biomedical Imaging (ISBI), 2014 IEEE 11th International Symposium on
  • Conference_Location
    Beijing
  • Type

    conf

  • DOI
    10.1109/ISBI.2014.6867885
  • Filename
    6867885