• DocumentCode
    1772829
  • Title

    Combining fault tolerance and self repair at minimum cost in power and hardware

  • Author

    Koal, Tobias ; Scholzel, Mario ; Vierhaus, Heinrich T.

  • Author_Institution
    Comput. Eng. Group, Brandenburg Univ. of Technol. Cottbus-Senftenberg, Brandenburg, Germany
  • fYear
    2014
  • fDate
    23-25 April 2014
  • Firstpage
    153
  • Lastpage
    158
  • Abstract
    Large-scale integrated circuits and systems fabricated in nano-technologies exhibit new and enhanced fault properties which limit both their reliability and their life time. Transient fault effects have found most attention so far. They must be handled by on-line check and fault compensation based on duplication and triplication, typically at a significant amount of extra power. Such techniques are not suitable for life time extension, since their redundant elements all undergo wear-out effects in hot operation. Repair technologies that perform a process of system re-organization and introduction of cold redundancy may extend system life time, but they are too slow to catch and correct transient and permanent fault effects in hot operation. The essential task therefore remains to find methods and architectures that will provide on-line check in combination with self repair techniques at a minimum cost in extra power.
  • Keywords
    fault tolerance; integrated circuit economics; integrated circuit reliability; large scale integration; nanofabrication; cold redundancy introduction; enhanced fault property; fault compensation; fault tolerance; large-scale integrated circuits; life time extension; nanotechnology; on-line check; permanent fault effect; repair technology; self-repair technique; system re-organization; transient fault effect; transient fault effects; wear-out effects; Circuit faults; Clocks; Flip-flops; Maintenance engineering; Timing; Transient analysis; Tunneling magnetoresistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Diagnostics of Electronic Circuits & Systems, 17th International Symposium on
  • Conference_Location
    Warsaw
  • Print_ISBN
    978-1-4799-4560-3
  • Type

    conf

  • DOI
    10.1109/DDECS.2014.6868780
  • Filename
    6868780