DocumentCode :
177283
Title :
Architecture implications of pads as a scarce resource
Author :
Runjie Zhang ; Ke Wang ; Meyer, Brett H. ; Stan, M.R. ; Skadron, Kevin
Author_Institution :
Univ. of Virginia, Charlottesville, VA, USA
fYear :
2014
fDate :
14-18 June 2014
Firstpage :
373
Lastpage :
384
Abstract :
Due to non-ideal technology scaling, delivering a stable supply voltage is increasingly challenging. Furthermore, competition for limited chip interface resources (i.e., C4 pads) between power supply and I/O, and the loss of such resources to electromigration, means that constructing a power delivery network (PDN) that satisfies noise margins without compromising performance is and will remain a critical problem for architects and circuit designers alike. Simple guardbanding will no longer work, as the consequent performance penalty will grow with technology scaling. In this paper, we develop a pre-RTL PDN model, VoltSpot, for the purpose of studying the performance and noise tradeoffs among power supply and I/O pad allocation, the effectiveness of noise mitigation techniques, and the consequent implications of electromigration-induced PDN pad failure. Our simulations demonstrate that, despite their integral role in the PDN, power/ground pads can be aggressively reduced (by conversion into I/O pads) to their electromigration limit with minimal performance impact from extra voltage noise - provided the system implements a suitable noise-mitigation strategy. The key observation is that even though reducing power/ground pads significantly increases the number of voltage emergencies, the average noise amplitude increase is small. Overall, we can triple I/O bandwidth while maintaining target lifetimes and incurring only 1.5% slowdown.
Keywords :
electromigration; failure analysis; microprocessor chips; power aware computing; I/O bandwidth; I/O pad allocation; VoltSpot; electromigration-induced PDN pad failure; limited chip interface resources; noise amplitude; noise mitigation techniques; noise tradeoffs; pad architecture implications; power delivery network; voltage emergencies; Abstracts; Adaptation models; Erbium; System-on-chip; Transient analysis; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Architecture (ISCA), 2014 ACM/IEEE 41st International Symposium on
Conference_Location :
Minneapolis, MN
Print_ISBN :
978-1-4799-4396-8
Type :
conf
DOI :
10.1109/ISCA.2014.6853199
Filename :
6853199
Link To Document :
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