DocumentCode
1772850
Title
Path delay test in the presence of multi-aggressor crosstalk, power supply noise and ground bounce
Author
Asokan, A. ; Todri-Sanial, A. ; Bosio, A. ; Dilillo, L. ; Girard, P. ; Pravossoudovitch, S. ; Virazel, A.
Author_Institution
LIRMM, Univ. of Montpellier II, Montpellier, France
fYear
2014
fDate
23-25 April 2014
Firstpage
207
Lastpage
212
Abstract
Physical Design (PD) issues are becoming a major challenge with technology scaling in integrated circuits. Multi-aggressor crosstalk, power supply noise and ground bounce are some of the PD issues that cause considerable path delay variations. Therefore, these PD issues need to be considered during path delay testing to ensure better delay defect coverage. In this paper, we first show that the path delay Automatic Test Pattern Generation (ATPG) test methods are incapable of generating an input pattern that can capture worst-case path delay in circuits. We, then present our Physical Design Aware Pattern Generation (PDAPG) method to generate an input test pattern that can capture worst-case path delay in the presence of PD issues. We propose a backtrace X-filling approach to identify the relevant X-bits causing worst-case path delay. Simulations performed on ITC´99 benchmark circuits show that our PDAPG method is capable of providing high quality input test patterns in comparison with conventional path delay ATPG test methods.
Keywords
automatic test pattern generation; crosstalk; integrated circuit design; integrated circuit noise; integrated circuit testing; power supply circuits; ITC´99 benchmark circuits; PD issues; PDAPG method; automatic test pattern generation test methods; backtrace X-filling approach; delay defect coverage; ground bounce; input test patterns; integrated circuits; multiaggressor crosstalk; path delay ATPG test methods; path delay testing; path delay variations; physical design aware pattern generation method; physical design issues; power supply noise; Automatic test pattern generation; Crosstalk; Delays; Integrated circuit interconnections; Logic gates; SPICE; X-bit filling; automatic test pattern generation (ATPG); ground bounce; multi-aggressor crosstalk; path delay variations; power supply noise;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Diagnostics of Electronic Circuits & Systems, 17th International Symposium on
Conference_Location
Warsaw
Print_ISBN
978-1-4799-4560-3
Type
conf
DOI
10.1109/DDECS.2014.6868791
Filename
6868791
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