• DocumentCode
    1772850
  • Title

    Path delay test in the presence of multi-aggressor crosstalk, power supply noise and ground bounce

  • Author

    Asokan, A. ; Todri-Sanial, A. ; Bosio, A. ; Dilillo, L. ; Girard, P. ; Pravossoudovitch, S. ; Virazel, A.

  • Author_Institution
    LIRMM, Univ. of Montpellier II, Montpellier, France
  • fYear
    2014
  • fDate
    23-25 April 2014
  • Firstpage
    207
  • Lastpage
    212
  • Abstract
    Physical Design (PD) issues are becoming a major challenge with technology scaling in integrated circuits. Multi-aggressor crosstalk, power supply noise and ground bounce are some of the PD issues that cause considerable path delay variations. Therefore, these PD issues need to be considered during path delay testing to ensure better delay defect coverage. In this paper, we first show that the path delay Automatic Test Pattern Generation (ATPG) test methods are incapable of generating an input pattern that can capture worst-case path delay in circuits. We, then present our Physical Design Aware Pattern Generation (PDAPG) method to generate an input test pattern that can capture worst-case path delay in the presence of PD issues. We propose a backtrace X-filling approach to identify the relevant X-bits causing worst-case path delay. Simulations performed on ITC´99 benchmark circuits show that our PDAPG method is capable of providing high quality input test patterns in comparison with conventional path delay ATPG test methods.
  • Keywords
    automatic test pattern generation; crosstalk; integrated circuit design; integrated circuit noise; integrated circuit testing; power supply circuits; ITC´99 benchmark circuits; PD issues; PDAPG method; automatic test pattern generation test methods; backtrace X-filling approach; delay defect coverage; ground bounce; input test patterns; integrated circuits; multiaggressor crosstalk; path delay ATPG test methods; path delay testing; path delay variations; physical design aware pattern generation method; physical design issues; power supply noise; Automatic test pattern generation; Crosstalk; Delays; Integrated circuit interconnections; Logic gates; SPICE; X-bit filling; automatic test pattern generation (ATPG); ground bounce; multi-aggressor crosstalk; path delay variations; power supply noise;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Diagnostics of Electronic Circuits & Systems, 17th International Symposium on
  • Conference_Location
    Warsaw
  • Print_ISBN
    978-1-4799-4560-3
  • Type

    conf

  • DOI
    10.1109/DDECS.2014.6868791
  • Filename
    6868791