• DocumentCode
    1773253
  • Title

    Thermoplastic materials for electrical applications - Surface aging test methods evaluation

  • Author

    Martini, Harald ; Su Zhao ; Gentsch, Dietmar ; Corti, Donatella

  • Author_Institution
    ABB Corp. Res., Vasteras, Sweden
  • fYear
    2014
  • fDate
    8-11 June 2014
  • Firstpage
    115
  • Lastpage
    118
  • Abstract
    Higher demand on recyclability and cost efficiency enforce the utilization of thermoplastic materials as electrical insulation in medium and high voltage applications. The long-term aging properties of the thermoplastic materials have to be investigated with the help of accelerated testing methods. One technical report IEC 60932 and one technical specification IEC 62271-304 have been published, describing testing methods simulating the aging of equipment in severe service conditions in terms of condensation and pollution. These methods demand special test equipment and are very time consuming. In the previous work, a fast materials screening test method has been developed in-house. In this work, two model thermoplastic materials were tested using the in-house screening method and the two IEC methods. The time-to-failure from these tests were compared, in order to build up their correlation. Based on the results from the rapid screening method, one might be able to predict the lifetime of the different thermoplastic materials in the future.
  • Keywords
    ageing; condensation; insulation testing; life testing; materials testing; IEC 60932; IEC 62271-304; accelerated testing; condensation; cost efficiency; electrical applications; electrical insulation; fast materials screening test method; high voltage applications; in-house screening method; long-term aging properties; medium voltage applications; pollution; recyclability; surface aging test methods evaluation; thermoplastic materials; Aging; Degradation; IEC standards; Materials; Surface resistance; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference (EIC), 2014
  • Conference_Location
    Philadelphia, PA
  • Print_ISBN
    978-1-4799-2787-6
  • Type

    conf

  • DOI
    10.1109/EIC.2014.6869359
  • Filename
    6869359