• DocumentCode
    1773256
  • Title

    Acoustic emission from partial discharges in solid dielectrics

  • Author

    Czaszejko, Tadeusz ; Sookun, Jonathan

  • Author_Institution
    Dept. of Electr. & Comput. Syst. Eng., Monash Univ., Melbourne, VIC, Australia
  • fYear
    2014
  • fDate
    8-11 June 2014
  • Firstpage
    119
  • Lastpage
    123
  • Abstract
    Properties of acoustic signals emitted from PD sources in solid dielectrics are less well known in comparison with those in liquids. We have investigated three materials used typically as insulation in high voltage cables and their accessories, namely, polyethylene (PE), silicon rubber (SiR) and ethylene-propylene-diene monomer (EPDM). Several simple geometries of defects were considered, such as spherical voids, cylindrical cavities and fissures. COMSOL Multiphysics software was used to conduct computer modelling of acoustic emission caused by PDs in such defects. A relationship between defect dimensions and frequency of the acoustic signal emitted was established. In spherical voids and cylindrical cavities f ~ 1/d, where d is the void size. In fissures, f ~ 1/(t0.37w0.5), where t is the fissure thickness and w is the fissure width.
  • Keywords
    acoustic emission; ethylene-propylene rubber; partial discharge measurement; polyethylene insulation; power cable insulation; silicone rubber; COMSOL Multiphysics software; EPDM; PD sources; SiR; acoustic emission; acoustic signal frequency; acoustic signals; cylindrical cavities; ethylene-propylene-diene monomer; fissures; high voltage cables; partial discharges; polyethylene; silicon rubber; solid dielectrics; spherical voids; Acoustics; Cavity resonators; Computational modeling; Dielectrics; Insulation; Materials; Partial discharges; acoustic emission; partial discharge; solid dielectrics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference (EIC), 2014
  • Conference_Location
    Philadelphia, PA
  • Print_ISBN
    978-1-4799-2787-6
  • Type

    conf

  • DOI
    10.1109/EIC.2014.6869360
  • Filename
    6869360