• DocumentCode
    1774130
  • Title

    Wide-band gap devices in PV systems - opportunities and challenges

  • Author

    Sintamarean, C. ; Eni, E. ; Blaabjerg, Frede ; Teodorescu, Remus ; Wang, Huifang

  • Author_Institution
    Dept. of Energy Technol., Aalborg Univ., Aalborg, Denmark
  • fYear
    2014
  • fDate
    18-21 May 2014
  • Firstpage
    1912
  • Lastpage
    1919
  • Abstract
    The recent developments in wide band-gap devices based GaN and SiC is showing a high impact on the PV-inverter technology, which is strongly influenced by efficiency, power density and cost. Besides the high efficiency of PV inverters, also the mechanical size, the compactness and simple structure have an important role in the cost reduction. To increase the efficiency of PV systems, most of solutions for PV inverters have moved to three-level (3L) structures reaching typical efficiencies of 98% due to low switching losses of 600V Si IGBT or MOSFET and reduced core losses in the filter. With the appearance of SiC 1200V MOSFETs, it becomes possible to return to more simple two-level (2L) structure with comparable efficiency but high potential to reduce the overall cost. This paper deals with a comparison study between a Si-based 3L-Diode Neutral Point Clamped (DNPC) and a SiC-based 2L-Full Bridge (FB) three-phase PV-inverter topologies in terms of efficiency, thermal loading distribution and costs. Moreover the above mentioned PV-inverters are built and tested in laboratory in order to validate the obtained results.
  • Keywords
    III-V semiconductors; cost reduction; gallium compounds; invertors; network topology; photovoltaic power systems; power MOSFET; power filters; power semiconductor diodes; power semiconductor switches; silicon compounds; wide band gap semiconductors; 2L-full bridge three phase PV inverter topology; 3L-diode neutral point clamped; DNPC; FB; GaN; MOSFET; PV system; SiC; cost distribution; cost reduction; lGBT; mechanical size; power density; power filter; reduced core loss; switching losses; thermal loading distribution; two level structure; voltage 1200 V; voltage 600 V; wideband gap device; Conductivity; Electric breakdown; Gallium nitride; Performance evaluation; Silicon; Silicon carbide; Switches; cost analyse; efficiency measurement; high switching frequency operation; thermal loading;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE-ASIA), 2014 International
  • Conference_Location
    Hiroshima
  • Type

    conf

  • DOI
    10.1109/IPEC.2014.6869846
  • Filename
    6869846