DocumentCode
1774488
Title
Experimental switching frequency limits of 15 kV SiC N-IGBT module
Author
Kadavelugu, Arun ; Bhattacharya, Surya ; Sei-Hyung Ryu ; Van Brunt, E. ; Grider, David ; Leslie, Scott
Author_Institution
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
fYear
2014
fDate
18-21 May 2014
Firstpage
3726
Lastpage
3733
Abstract
This paper presents extensive experimental switching characteristics of a state-of-the-art 15 kV SiC N-IGBT (0.32 cm2 active area) up to 10 kV, 10 A and 175°C. The influence of the thermal resistance of the module package, cooling mechanism, and the increased energy loss with temperature are investigated for determining the switching frequency limits of the IGBT. Detailed FEM analysis is conducted for extracting the thermal resistance of each layer in the 15 kV module from the IGBT junction to the base plate, and then down to the ambient. Using this thermal information and the experimental switching data, the inductive switching frequency limits are analytically evaluated for liquid and air cooling cases with 660 W/cm2 and 550 W/cm2 power dissipation densities respectively, considering 150°C as maximum junction temperature. The air cooling power dissipation density of the 15 kV IGBT is experimentally validated using a dc-dc boost converter at 10 kV, 6.4 kW output and 550 W/cm2 under steady state operating conditions. The gate resistances used for the entire experiments are RG(ON) = 20 Ω and RG(OFF) = 10 Ω.
Keywords
elemental semiconductors; finite element analysis; insulated gate bipolar transistors; power convertors; silicon compounds; FEM analysis; IGBT junction; N-IGBT module; SiC; cooling mechanism; experimental switching frequency limits; inductive switching frequency limits; module package; power 6.4 kW; thermal resistance extraction; voltage 10 kV; voltage 15 kV; Electrical resistance measurement; Heating; Insulated gate bipolar transistors; Integrated circuits; Steady-state; Switches; Thermal loading; 15 kV SiC IGBT; hard-switching capability; thermal resisistance; turn-off energy loss with temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE-ASIA), 2014 International
Conference_Location
Hiroshima
Type
conf
DOI
10.1109/IPEC.2014.6870034
Filename
6870034
Link To Document