DocumentCode :
1774546
Title :
Comparative thermal performance evaluation of SiC MOSFETs and Si MOSFET for 1.2 kW 300 kHz DC-DC boost converter as a solar PV pre-regulator
Author :
Taekyun Kim ; Minsoo Jang ; Agelidis, Vassilios Georgios
Author_Institution :
Sch. of Electr. Eng. & Telecommun., Univ. of New South Wales (UNSW), Sydney, NSW, Australia
fYear :
2014
fDate :
18-21 May 2014
Firstpage :
3933
Lastpage :
3937
Abstract :
In this paper a comparative thermal performance evaluation of SiC MOSFETs (SiC MOSFET and SiC Z-FET) and Si MOSFET in a high power density of 1.2 kW DC-DC boost converter as a photovoltaic pre-regulator is presented. The good thermal stability of the converter expected from both SiC MOSFETs at high switching frequency up to 300 kHz and high case temperature of 150 °C has been demonstrated by comparing with Si MOSFET. Faster turn-on switching time for SiC MOSFETs, compared with Si MOSFET leads to reduced turn-on switching losses, and consequently the heat sink temperature at 300 kHz switching frequency reaches only at around 50 °C in natural convection. The experimental results given in this paper show that SiC technologies aid in improving reliability of solar PV inverters by enhancing thermal stability of the system.
Keywords :
DC-DC power convertors; MOSFET; elemental semiconductors; heat sinks; invertors; natural convection; silicon; silicon compounds; solar cells; switching convertors; thermal stability; wide band gap semiconductors; DC-DC boost converter; MOSFET; Si; SiC; frequency 300 kHz; heat sink temperature; high power density; photovoltaic preregulator; power 1.2 kW; solar PV inverter reliability; solar PV preregulator; switching frequency; temperature 150 degC; thermal performance evaluation; thermal stability; turn-on switching losses; Inverters; Lead; MOSFET; Regulators; Reliability; Silicon carbide; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE-ASIA), 2014 International
Conference_Location :
Hiroshima
Type :
conf
DOI :
10.1109/IPEC.2014.6870064
Filename :
6870064
Link To Document :
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