• DocumentCode
    1774607
  • Title

    Insulated metal substrate for power modules using anodic oxide film of aluminum

  • Author

    Tokuyama, Takeshi ; Kusukawa, Jumpei ; Nakatsu, Kinya

  • Author_Institution
    Dept. of Power Electron. Syst. Res., Hitachi Res. Lab., Ltd., Hitachi, Japan
  • fYear
    2014
  • fDate
    18-21 May 2014
  • Firstpage
    2904
  • Lastpage
    2909
  • Abstract
    To improve the insulation reliability of insulated metal substrates for power modules, we propose an insulated metal substrate that has a porous alumina anodic oxide film along the interface between an aluminum base and resin insulating layer. By having two anodic oxide films, i.e., inorganic and organic acids, compared with conventional substrates, the proposed substrate improves the adhesiveness with the resin insulating layer, resulting in 160% improvement in insulation resistance after 2400 h under atmospheric condition in which the temperature was 85°C and relative humidity was 85%, and 30% improvement in breakdown voltage compared with conventional substrates.
  • Keywords
    alumina; humidity; insulating thin films; porous materials; reliability; resins; Al; Al2O3; atmospheric condition; breakdown voltage improvement; insulated metal substrate; insulation reliability; insulation resistance; porous alumina anodic oxide film; power module; relative humidity; resin insulating layer; Aluminum; Films; Insulation; Reliability; Resins; Resistance; Substrates; Anodic Oxide Film of Aluminum; Insulated Metal Substrate; Migration; Power Module;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE-ASIA), 2014 International
  • Conference_Location
    Hiroshima
  • Type

    conf

  • DOI
    10.1109/IPEC.2014.6870094
  • Filename
    6870094