DocumentCode
1774607
Title
Insulated metal substrate for power modules using anodic oxide film of aluminum
Author
Tokuyama, Takeshi ; Kusukawa, Jumpei ; Nakatsu, Kinya
Author_Institution
Dept. of Power Electron. Syst. Res., Hitachi Res. Lab., Ltd., Hitachi, Japan
fYear
2014
fDate
18-21 May 2014
Firstpage
2904
Lastpage
2909
Abstract
To improve the insulation reliability of insulated metal substrates for power modules, we propose an insulated metal substrate that has a porous alumina anodic oxide film along the interface between an aluminum base and resin insulating layer. By having two anodic oxide films, i.e., inorganic and organic acids, compared with conventional substrates, the proposed substrate improves the adhesiveness with the resin insulating layer, resulting in 160% improvement in insulation resistance after 2400 h under atmospheric condition in which the temperature was 85°C and relative humidity was 85%, and 30% improvement in breakdown voltage compared with conventional substrates.
Keywords
alumina; humidity; insulating thin films; porous materials; reliability; resins; Al; Al2O3; atmospheric condition; breakdown voltage improvement; insulated metal substrate; insulation reliability; insulation resistance; porous alumina anodic oxide film; power module; relative humidity; resin insulating layer; Aluminum; Films; Insulation; Reliability; Resins; Resistance; Substrates; Anodic Oxide Film of Aluminum; Insulated Metal Substrate; Migration; Power Module;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE-ASIA), 2014 International
Conference_Location
Hiroshima
Type
conf
DOI
10.1109/IPEC.2014.6870094
Filename
6870094
Link To Document