• DocumentCode
    1774796
  • Title

    Analysis on scattering parameters for coupled microstrip lines with bend discontinuities

  • Author

    Jiao He ; Liangqi Gui ; Tao Jiang ; Cong Zhou ; Lang Lv

  • Author_Institution
    Nat. Key Lab. of Sci. & Technol. on Multi-spectral Inf. Process., China
  • fYear
    2014
  • fDate
    23-25 Oct. 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, we propose a method to analyze the scattering parameters for coupled microstrip lines with bend discontinuities. The key idea of the proposed method is to analyze the coupled bends and parallel coupled lines individually. Specifically, the equivalent π circuit model is built to approximate coupled bends and the corresponding scattering matrix is obtained by converting Z-matrix; the scattering matrix of parallel coupled lines is acquired by the odd-even mode theory. Then, we can compute the scattering parameters of the coupled microstrip lines with bend discontinuities based on the cascade property of transmission matrix, which is transformed from the scattering matrix. The agreement between theoretical results and simulation results shows the effectiveness of the proposed method. Moreover, the method avoids complex mixed integral operations and provides guidance for designing bent coupled microstrip lines.
  • Keywords
    S-matrix theory; S-parameters; electromagnetic coupling; microstrip discontinuities; Z-matrix conversion; equivalent π circuit model; odd-even mode theory; parallel coupled microstrip line bend discontinuity; scattering matrix; scattering parameter analysis; transmission matrix; Integrated circuit modeling; Matrix converters; Microstrip; Scattering; Scattering parameters; Silicon; Transmission line matrix methods; Scattering parameters; bend discontinuities; coupled microstrip lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Communications and Signal Processing (WCSP), 2014 Sixth International Conference on
  • Conference_Location
    Hefei
  • Type

    conf

  • DOI
    10.1109/WCSP.2014.6992021
  • Filename
    6992021