DocumentCode :
1775039
Title :
Molecular dynamics simulation for epoxy-based nanocomposites
Author :
Sawa, Fumio ; Imai, Tetsuro
Author_Institution :
Toshiba Corp., Kawasaki, Japan
fYear :
2014
fDate :
1-5 June 2014
Firstpage :
327
Lastpage :
329
Abstract :
Nanocomposites with nano-filler and thermosetting resins such as epoxy are the promising materials for the insulating materials. To achieve the good properties of nanocomposites, it is important to control the interfaces between nano-filler surface and the matrix resins. To clarify the role of nano scale interface on macroscopic properties, we have conducted a molecular dynamics simulation with using coarse graining method (bead-spring model). We have investigated the molecular motion near the interface between nano-fillers and matrix thermosetting resins. It was observed that the mobility of the molecules of matrix resin close to the nano-filler surfaces is different from the bulk regions.
Keywords :
filled polymers; molecular dynamics method; nanocomposites; nanofibres; resins; bead-spring model; coarse graining method; epoxy-based nanocomposites; insulating materials; macroscopic properties; matrix thermosetting resins; molecular dynamics simulation; molecular motion; nanofiller surface; nanoscale interface; Nanocomposites; Resins; coarse grained molecular dynamics; epoxy; nanocomposites; thermosetting resin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulating Materials (ISEIM), Proceedings of 2014 International Symposium on
Conference_Location :
Niigata
Type :
conf
DOI :
10.1109/ISEIM.2014.6870785
Filename :
6870785
Link To Document :
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