• DocumentCode
    1775039
  • Title

    Molecular dynamics simulation for epoxy-based nanocomposites

  • Author

    Sawa, Fumio ; Imai, Tetsuro

  • Author_Institution
    Toshiba Corp., Kawasaki, Japan
  • fYear
    2014
  • fDate
    1-5 June 2014
  • Firstpage
    327
  • Lastpage
    329
  • Abstract
    Nanocomposites with nano-filler and thermosetting resins such as epoxy are the promising materials for the insulating materials. To achieve the good properties of nanocomposites, it is important to control the interfaces between nano-filler surface and the matrix resins. To clarify the role of nano scale interface on macroscopic properties, we have conducted a molecular dynamics simulation with using coarse graining method (bead-spring model). We have investigated the molecular motion near the interface between nano-fillers and matrix thermosetting resins. It was observed that the mobility of the molecules of matrix resin close to the nano-filler surfaces is different from the bulk regions.
  • Keywords
    filled polymers; molecular dynamics method; nanocomposites; nanofibres; resins; bead-spring model; coarse graining method; epoxy-based nanocomposites; insulating materials; macroscopic properties; matrix thermosetting resins; molecular dynamics simulation; molecular motion; nanofiller surface; nanoscale interface; Nanocomposites; Resins; coarse grained molecular dynamics; epoxy; nanocomposites; thermosetting resin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials (ISEIM), Proceedings of 2014 International Symposium on
  • Conference_Location
    Niigata
  • Type

    conf

  • DOI
    10.1109/ISEIM.2014.6870785
  • Filename
    6870785