• DocumentCode
    1775081
  • Title

    Analysis on thermally stimulated currents in polyethylene-terephthalate and polyethylene-naphthalate

  • Author

    Peng Yang ; Ohki, Y. ; Fuqiang Tian

  • Author_Institution
    Dept. of Electr. Eng. & Biosci., Waseda Univ., Tokyo, Japan
  • fYear
    2014
  • fDate
    1-5 June 2014
  • Firstpage
    401
  • Lastpage
    404
  • Abstract
    Through analysis of thermally stimulated polarization and depolarization currents (TSPC and TSDC), dielectric properties of polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) are compared. Since the two polymers have very similar chemical structures, their dielectric properties are also similar. However, the temperature at which TSPC or TSDC starts to increase rapidly is about 20 °C higher in PEN than in PET. This difference is mostly due to the fact that the glass transition temperature Tg is higher in PEN. This means that thermal properties including the glass transition affect significantly the dielectric behavior of PET and PEN. At temperatures about 30 °C lower than Tg, the two polymers show a hump in their first-run TSPC spectra, probably originating from impurity or moisture. It is also clearly demonstrated that both PET and PEN can be reliable electrical insulating materials, especially at temperatures below their Tg´s.
  • Keywords
    dielectric properties; polyethylene insulation; thermally stimulated currents; chemical structures; dielectric properties; glass transition temperature; polyethylene naphthalate; polyethylene terephthalate; thermally stimulated currents; thermally stimulated depolarization currents; thermally stimulated polarization currents; Chemicals; Dielectrics; Materials reliability; Polymers; Positron emission tomography; PEN; PET; dielectric property; thermally stimulated current (TSC);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials (ISEIM), Proceedings of 2014 International Symposium on
  • Conference_Location
    Niigata
  • Type

    conf

  • DOI
    10.1109/ISEIM.2014.6870804
  • Filename
    6870804