PCB pad design for board to board SMP connector

Author

Anwang Xu ; Zhuo Li ; Jian Yan ; Jianye Liu

Author_Institution

Key Lab. of Radar Imaging & Microwave Photonics, Nanjing Univ. of Aeronaut. & Astronaut. Nanjing, Nanjing, China

fYear

2014

fDate

26-29 July 2014

Firstpage

1264

Lastpage

1266

Abstract

The design of printed circuit board (PCB) pad for SMP connector is presented. A detailed design and parameterization study are performed using HFSS, a commercial finite element tool. The PCB pad for the vertical SMP connector and surface mounted SMP connector are optimized. According to the simulation result, the return loss and insertion loss for SMP-to-microstrip transitions are better than 26 dB and 0.12 dB respectively from DC to 6 GHz, and the return loss and insertion loss for SMP-to-coplanar waveguide (CPW) transitions are better than 10 dB and 0.7 dB respectively up to 26.5 GHz.

Keywords

coplanar waveguides; finite element analysis; printed circuit design; HFSS; PCB pad design; SMP-to-coplanar waveguide; SMP-to-microstrip transitions; board to board SMP connector; finite element tool; frequency 26.5 GHz; frequency 6 GHz; insertion loss; printed circuit board pad design; return loss; surface mounted SMP connector; Connectors; Coplanar waveguides; Insertion loss; Microstrip; Simulation; Surface waves; Waveguide transitions;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation (APCAP), 2014 3rd Asia-Pacific Conference on

Conference_Location

Harbin

Print_ISBN

978-1-4799-4355-5

Type

conf

DOI

10.1109/APCAP.2014.6992748

Filename

6992748