A novel planar interconnection structure with substrate integrated waveguide

Author

Hui Zhang ; Wei Hong ; Peng Chen ; Hongjun Tang

Author_Institution

State Key Lab. of Millimeter Waves, Southeast Univ., Nanjing, China

fYear

2014

fDate

26-29 July 2014

Firstpage

1296

Lastpage

1299

Abstract

In this paper, a novel planar interconnection method with substrate integrated waveguide (SIW) is presented. This method can be used as planar microwave structure interconnection in millimeter wave band. It also provides a quick assembly and disassembly of interconnection with different modules without any soldering or wire bonding operations. A W-band SIW interconnection structure is simulated and experimented. The simulated and measured results show the SIW interconnection structure has a high constituency with the complete board on transmission and reflection properties.

Keywords

interconnections; microstrip lines; substrate integrated waveguides; W-band SIW interconnection structure; millimeter wave band; planar interconnection structure; planar microwave structure interconnection; quick assembly interconnection; quick disassembly interconnection; substrate integrated waveguide; Integrated circuit interconnections; Microstrip; Millimeter wave technology; Splicing; Substrates; Waveguide transitions; Interconnection; SIW; Splicing; microstrip; substrate integrated waveguide; transition;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation (APCAP), 2014 3rd Asia-Pacific Conference on

Conference_Location

Harbin

Print_ISBN

978-1-4799-4355-5

Type

conf

DOI

10.1109/APCAP.2014.6992758

Filename

6992758