DocumentCode
1776026
Title
Coordinationof the diode and capacitor in the Tx line for the protection of the chipsetfrom EOS
Author
Sigyung Song ; Bo Pu ; Taeho Kim ; Jungje Bae ; Duckjin Kim ; Wansoo Nah
Author_Institution
Mobile Commun. Div., Samsung Electron., Suwon, South Korea
fYear
2014
fDate
26-29 July 2014
Firstpage
1432
Lastpage
1435
Abstract
This paper proposes a PCB design method of highspeed signal interface that is robust against electrical overstress (EOS). Surge and electrostatic discharge (ESD) waveforms as defined in the International Electro-technical Commission (IEC)61000-4 standard were used for EOS input waveforms from the connector to the printed circuit board (PCB). Signals in the Tx line of the universal serial bus 3.0 (USB3.0) interface were simulated to analyze the role of the diode and capacitor in the interface circuit, and it was found that the proposed capacitor and diode coordination shows the best combination of schematics for the prevention of EOS. Experiments with an interface circuit in a laptop computer were also performed and the results show that the effectiveness of proposed design is valid.
Keywords
IEC standards; capacitors; electrostatic discharge; printed circuit design; radio transmitters; semiconductor diodes; (IEC)61000-4 standard; International Electro-technical Commission; PCB design method; Tx line chipset; USB3.0 interface; capacitor; diode; electrical overstress; electrostatic discharge waveform; high speed signal interface; interface circuit; laptop computer; printed circuit board; surge waveform; universal serial bus 3.0; Capacitors; Earth Observing System; Electrostatic discharges; IEC standards; Robustness; Surge protection; Surges; EMC; EOS; ESD; Immunity; Surge;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation (APCAP), 2014 3rd Asia-Pacific Conference on
Conference_Location
Harbin
Print_ISBN
978-1-4799-4355-5
Type
conf
DOI
10.1109/APCAP.2014.6992797
Filename
6992797
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