• DocumentCode
    1776026
  • Title

    Coordinationof the diode and capacitor in the Tx line for the protection of the chipsetfrom EOS

  • Author

    Sigyung Song ; Bo Pu ; Taeho Kim ; Jungje Bae ; Duckjin Kim ; Wansoo Nah

  • Author_Institution
    Mobile Commun. Div., Samsung Electron., Suwon, South Korea
  • fYear
    2014
  • fDate
    26-29 July 2014
  • Firstpage
    1432
  • Lastpage
    1435
  • Abstract
    This paper proposes a PCB design method of highspeed signal interface that is robust against electrical overstress (EOS). Surge and electrostatic discharge (ESD) waveforms as defined in the International Electro-technical Commission (IEC)61000-4 standard were used for EOS input waveforms from the connector to the printed circuit board (PCB). Signals in the Tx line of the universal serial bus 3.0 (USB3.0) interface were simulated to analyze the role of the diode and capacitor in the interface circuit, and it was found that the proposed capacitor and diode coordination shows the best combination of schematics for the prevention of EOS. Experiments with an interface circuit in a laptop computer were also performed and the results show that the effectiveness of proposed design is valid.
  • Keywords
    IEC standards; capacitors; electrostatic discharge; printed circuit design; radio transmitters; semiconductor diodes; (IEC)61000-4 standard; International Electro-technical Commission; PCB design method; Tx line chipset; USB3.0 interface; capacitor; diode; electrical overstress; electrostatic discharge waveform; high speed signal interface; interface circuit; laptop computer; printed circuit board; surge waveform; universal serial bus 3.0; Capacitors; Earth Observing System; Electrostatic discharges; IEC standards; Robustness; Surge protection; Surges; EMC; EOS; ESD; Immunity; Surge;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation (APCAP), 2014 3rd Asia-Pacific Conference on
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4799-4355-5
  • Type

    conf

  • DOI
    10.1109/APCAP.2014.6992797
  • Filename
    6992797