A simple multi-purpose method for compact model evaluation

A simple method for data analysis in semiconductor device characterization and compact modeling is proposed. The method allows for a direct comparison of data originating from different sources, e.g. from measurement and simulation. The comparison is carried out via forming a direct correlation between the device characteristics under consideration, e.g. between the currents of the real device and the corresponding model. The resulting cloud of points together with the numerical indices characterizing their linear regression give information about the quality of fitting. The method is multipurpose and may be used for different tasks like scaling or variability effect investigation.